400G CFP8 과 CDFP 커넥터
CDFP (CD=400 in
Latin) 커넥터 is a four-generation system but the first 16x25G= 400G larger size module and interconnect system.
This solution uses one mezzanine connector, two PCBs and a four-row edge
receptacle connector in two styles with 120 contacts used in a 29.71 mm wide
module. Developing the thermal heat transfer path and larger heatsink design
was more challenging to develop and qualify. Cleverly combining heatsink
structures with metal cages have provided patent IP value for some interconnect
companies. Passive optical cables using 32 OM4 fibers and MPO connectors to
support 16 lanes have been deemed too costly for some potential applications.
It seems that some custom, inside-the-box usage of the CDFP and CFP connector
systems could have solved certain system packaging applications with similar
CDFP interconnect design/product verification
has utilized SFF-8679 transceiver, SFF-8636 Common Interface Standard, SFF-8472
Diagnostic Monitoring Interface and JESD22A114 ESD specifications.
CDFP developers have targeted using the developing
IEEE802.3bs specification for Ethernet 400GBaseSR,
400GBaseLR and 400GBaseER applications. They also targeted InfiniBand
EDR hydra cables and 128GFC applications but so far little market segment pick
up. It’s possible that some switched SAS 4.0 multi-port Nx24G links have been
installed, but not many. CDFP products are also measured to validate electrical
signal performance per IEEE802.3bm and OIF CEI-28-VSR with special compliance
boards. Some shipments have supported certain MAN, WAN, OTU and ITU based
Having 32 copper twin-ax elements contributed to
heavy and difficult to build precision cable assemblies. Holding CDFP 16
channels or lanes together relative to the System Layer Stack is much harder
and more costly than the more newly developing CFP8. Though relatively new with
2014 and 2015 rev releases, CDFP may be short lived due to the smaller more
efficient developing set of CFP8 solutions.
is the latest developing 8×50-56G=400-448G
form-factor version. Proposal and design/product development has been
going on for 9+ months. One proposal using the CFP large module size has not
gained much traction. However, there has been interest in a 400GBase-SR16 parallel MMF 16x25G NRZ proposal.
Another proposal is the 400GBase-FR8/LR8 duplex SMF
8x50G PAM4 WDM. This would use a 2×26=32 fiber MPO connector and OM4
The most evolutionary proposal is the 400GBaseDR4 4x100G
parallel SMF PAM4 signaling technology. This is targeted to fit in the CFP4
21.5-mm width module size, while using 12 (SMF) fibers within a 1×12 MPO
optical connector and the host board electrical 56-pin edge connector.
OIF CEI 56G, FC-PI-7, InfiniBand HDR, IEEE802.3bm,
IEEE802.3bs and Ethernet single lane 50G link specifications are being used for
It appears that this would be used for mostly active optical
modules, some active optical cables and maybe some very short active copper
cables applications that may be more expensive and power consuming. It appears
that this may be partially supplanted by use of internal mid-board
optical/electrical interconnect flyovers and bulkhead MPO or MXC connectors.
is an advanced nascent proposal for a narrower
4x100G module size close to the size of the new microQSFP module and
is a nascent concept and road-mapping effort
focusing on potential 5x200G=1T 2x500G=1T; remarkable of the exponential
science, engineering, manufacturing and business effort needed for each new
generation of high-speed interconnect network links. Signal and power integrity
and test measurement are the biggest parts of the challenge.
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